All Jobs/Process Engineer (Diffusion / Photo / Thin Film / Etch) (Ref: 240200016)
VIS
VIS

Process Engineer (Diffusion / Photo / Thin Film / Etch) (Ref: 240200016)

Others

Location

Singapore

Department

Others

Posted

1 month before

Full Job Description

Job Purpose: Sustain and improve process / SPC to meet quality, cost, productivity requirements Job Descriptions: Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices. Monitor critical SPC charts daily. Perform process window study and provide improvement plan to reduce OOC and improve CPK Review ESPC charts using SPACE. Know all the rules for ESPC Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE Create SPC charts, DCOP and modify SLDB using PROMIS (CAMSTAR) Upload recipe, check recipe and ensure recipe content compliance using RMS Raise PCRB and understands the requirements for PCRB opening, follow through with qual plan, analyze data using required software and CR closure Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN Setup and troubleshoot issues in recipes/job files in all metrology tools within the Module. Do regular housekeeping of production job files Follow up on pass down to troubleshoot process issues. Establish CAS / procedures to be followed and work with other departments for resolution if required Startup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance. Know the concept of repeatability and reproducibility (R&R) run Work on reducing process constraints so that Mfg can have more flexibility Perform process matching between equipment to reduce variation and analysis / DOE to find factors for better tool matching Participate in CIP programs to optimize process window, cost, yield, and productivity Work as a team with both Equipment and Mfg Engineers to meet Module objectives. Work to meet the key indices of Uptime and OEE goals Represent own Module to attend cross-functional task team to address yield improvement / excursion issues. Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs Follow good housekeeping and safety rules in office and Fab Provide feedback/training to AEs or Techs on their troubleshooting skills, understanding of processes, decision making, risk assessment Provide monthly report to Supervisor Participate in wafer scrap reduction. Ensure no human error Responsible and accountable for complying with and implementing environmental, health, safety and security (EHSS) system, policies, procedures and guidelines that are applicable to your scope of work, thereby maintaining a healthy and safe workspace Requirements: Degree in Electrical / Electronics /Microelectronics / Chemical Process Engineering / Chemistry / Physics related major Diploma holders 3 years working experience in Semiconductor Front-End Process Perform Normal/ Swing Shift ( or 12-hour rotating shift if required Good interpersonal skills and is an excellent team player Good verbal and written communication skill Logical thinking capability and good analytical skill High level of integrity with leadership attribute Highly committed with good ownership and accountability Passion for the semiconductor / manufacturing industry